Although there definitely are liquid-cooled PCs but understand those cannot be accommodated in smaller HMI Devices. Fujitsu recently announced development of a loop heat pipe that’s less than one millimeter thick, which could help future mobile devices to keep their cool.
Currently standard metallic heat sinks, PCM or solid materials such as graphite are used to remove heat.
Containing an unspecified liquid, it’s a closed system that consists of an evaporator located near a hot spot (such as a CPU) and a condenser in a cooler section of the phone. The two are linked together in a loop, by two tiny pipes.
The evaporator contains six 0.1-mm-thick stacked sheets of copper, each one perforated with an array of pores. The liquid climbs up through these pores (which are offset from one another), with the heat from the hot spot causing it to vaporize as it does so.
That vapor then travels along the “vapor line” pipe to the condenser, where the cooler temperature causes it to condense back into liquid, releasing its payload of heat energy in the process. That liquid subsequently travels back along the “liquid line,” returning to the evaporator to continue the process.
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