Thermoset Over Molding of Electronics – ISKARA
To get an integrated system the housing design, especially for the electronics is a very critical issue. Many points need to be covered accordingly like size, weight, thermal conductivity, mounting points, connectors, and integrated bearing shields. All this and more are possible in one part if you over-mold the electronics with a thermoset. This has the advantage that there is no air gap between the components on the PCBA and the housing. A very good thermal connection between the power components and outside can be archived with thermal connectivity of about 0.5 to 2.0 W/mK, even up to 10 W/mK is possible but more expensive. A method to avoid hitting the limits in point of price or thermal conductivity of thermoset is to insert metal inlays to get heat guides to external heat sinks. Refer to Smart Actuators – The Future of Automotive Systems.
Thermosets for the over-molding of electronics opens a completely new field of possibilities. It offers complete protection from liquids, dust, and high temperatures and also provides superior mechanical properties and stiffness.
- The low linear expansion coefficient offers a great basis for the over-molding of metal inserts.
- For serial production, this is the most cost-efficient method to completely protect your PCBs against classic automotive operating conditions.
- Using these materials requires an outside-the-box thinking approach to reach multifunctional hybrid component designs that can drastically reduce production costs.
Over-Molded Electronics can become structural components which leads to a reduction of assembly parts, large cost reduction (reduction of production/assembly processes), multifunctional hybrid components (simultaneously over-molding metal inserts and PCBs). A multi-piece housing design is replaced with an over-molded component with superior protection and mechanical properties.
Benefits that come only from Thermoset Over Molding:
- High mechanical stiffness,
- Good heat conductivity (in comparison with technical thermoplastics) as electronics generate heat.
- Excellent dimensional stability.
Other benefits of electronic encapsulation (similar to Hot melt and potting):
- Protection from liquids (e.g., oil, water… ),
- Protection from dust,
- Protection from high temperatures.
For more information contact Luka Bertoncelj, M.Sc. Head of research and development, http://www.iskra-isd.si/.
