Harting 3D-MID Component Carrier
3D Molded Interconnect Device (MID) technology replaces circuit boards by utilizing a 3-dimensional circuit on molded plastic to fit the space of a small applications. The 3D shape also allows a more compact integration of electrical components into the available space.
Below is standard MID solution developed by Harting and Patented.
- Universal design of substrate
- Customized layout for traces
- Use of high temperature plastic for reflow soldering.
- Shipped in tape & reel as sub-assembly for fully automated SMT processing.
- Significant cost savings due to elimination of mounting elements and simplification of assembly process – fully automated SMT assembly instead of manual assembly & soldering
For this MID SMT assembly of electronic component is as below:
- Apply solder paste.
- Apply glue for fixing the component.
- Reflow / vapor phase soldering.
- Packaging in Tape and Reel.
Below are two Application Examples:
- Two-channel Hall effect encoder for sensing the rotation of a motor shaft: Elimination of mounting elements (A) and THT components (B) coupled with simplification of assembly.
- Two sensor elements to detect position of a linear slide: Elimination of Flex-PCBs for realization of a 90° angle between IC and PCB (A), status LEDs integrated on small component carrier (B) with simplification of assembly.
For more information go to Harting WEB Site https://www.harting.com/3D-MID/en-gb/company/harting-ag-3d-mid or contact designhmi@gmail.com.
