Innovasonic Ultrasonic Self-Cleaning for Automotive Sensors (Cameras, LIDARs)
PiezoWipe™ concept is active self-cleaning process based on ultrasonic vibration, which targets the following types of contamination:
- environmental (dust, dirt, mud, bugs).
- Weather (raindrops, fog, ice).
- Human (fingerprints)
The system can be used in combination with passive hydrophobic coatings. The process is performed on-demand or automatically, using sensors to detect contamination event and type. PiezoWipe does not require any human attention, labor, materials, or chemicals. Removal of contamination and icing is fast and energy consumption is low (no heat).
Innovasonic is working to prove feasibility of the novel disinfection concept – ultrasonic disinfection. Ultrasonic method could provide fast, reliable, and safe disinfection for touch screens and other surfaces. It does not have any issues with potential skin and eyes exposure to dangerous UV light, used by competitors.
This opens new field to clean your windshield without wipers using nano technology to keep the windshield clean.
Next-generation Touch Screen Haptics uses ultrasonic surface haptics technology (PiezoTouch™) based on thin film piezoelectric transducers fabricated across an entire touch screen window. This concept allows seamless integration of haptics device with touch sensor to simplify manufacturing and drop the cost.
This technology could enable the perception of a broader
range of virtual textures and design of a variety of control elements (buttons, wheels, sliders, etc.). It could also provide design means for implementing local haptic effects and multi-finger haptic capabilities. PiezoTouch™ opens the way to design a new and improved tactile sensing and control features for mobile and public touch screen electronics and automotive and in-flight infotainment systems.
PirzoWipe™ increases safety in Level 3+ Autonomous Driving Vehicles due to dust and contamination of sensors – LIDARs/cameras/radars and others.
Modeled low frequency mode <500 kHz (Kirchhoff bending waves) and high frequency mode >10MHz (Surface Acoustic Waves). SAW implementation was not possible at Leti. Bending waves mode has been realized in prototypes. Two wafer lots (Si lot and Glass lot on 200 mm wafers); 4 designs (different T% & microstructure type).
For more information contact designhmi@gmail.com or click https://www.innovasonic.com.
