General “Interposer” capabilities
- High density contact arrays ( multi-row )
- Compressive or Surface-mount
- Ultra-low height: 0.30mm!
- Medium current: 1 – 2 Amps / contact
- High-speed Integrity: > 20 GHz @ -1db loss
High volume PCB based mfg. process
- Robust – high capacity panelization & laser drill
- Single contact panel makes 1,000+ interposers
- Core Unimicron strength – Top 3 PCB Manuf.
- Any Interposer shape without Mold tooling
Flexibility with Lithography:
- Contact Image transfer via artwork
- No stamping tool
- Intricate contact detail capability
- Any contact shape or pattern
- Contact force “tune-ability”
- Dual Beam – Redundant contacts
PCBeam™ Interposer Neoconix Interposer:
- Micro-spring contact array interface for B2B, B2F, or Modules-Board
- PCBeam™ micro spring contacts embedded onto PC Board
- Plated via’ s connect the top and bottom spring contacts
Capabilities:
- High density arrays ( multi-row )
- Ultra-low height: 0.35mm!
- High-current: 1 – 2 Amps / contact
- High-speed: > 20 GHz @ -1db loss
- Custom: shapes – sizes – pitch
- Rugged: Shock > 1,500 G’s
BOARD TO BOARD Connectivity with Neoconix Low Profile Terminals
For more information: www.neoconix.com
Neoconix offers a unique compressive B2B interconnect
Single compressive (SMT onto main PCB)
Dual compressive (springs on both side)
Interposer” is the contact array enabling connectivity between two substrates
The PCB’s must be aligned to one another
The interposer needs to be aligned to the PCB’s
For More Information go to: http://neoconix.com/
