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Molded interconnect devices technology

• MID Technology is the bridge between available micro- technologies and various applications in
• Automotive
• Medical technology
• Sensor packaging and sensor modules
• 3D-MID technology allows the combination of mechanical and electrical functions in one component.
• HARTING Mitronics accompanies the development process from beginning to end – from the initial idea through prototyping to production of the series product and its certification
• HARTING Mitronics offers a combination of controlled MID-processes and tailored assembly & packaging technologies.
• HARTING Mitronics is certified according to DIN ISO 9011, TS 16949 and ISO 14001

 

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Molded interconnect devices advantages

 

• 3D means solutions in three dimensions are possible 
• MID means Molded Interconnect Device
• A 3D circuit is realized by structuring the metal layers
• Simply speaking – a three-dimensional PCB.
• Reduced volume
• Small foot print on PCB
• 3D features are cost neutral
• Molding process guarantees high precision
• Tailored solutions at reasonable cost level
• Laser structuring allows easy design changes

 

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Circuit diagram

 

 

For further information contact http://www.harting-mitronics.ch/en.html